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NVIDIA and MediaTek Collaborate on Arm-Based CPUs with TSMC's CoWoS Technology
Recent reports suggest that NVIDIA and MediaTek are set to partner in developing Arm-based CPUs. These first-of-their-kind processors aim to compete against established players like Apple and Intel. Employing TSMC's sophisticated CoWoS (Chip on Wafer on Substrate) 2.5D packaging technology, the partnership may bring a fresh wave of high-end notebook CPUs to the market. This article delves into the intricate details of this collaboration and its potential implications for the industry.

NVIDIA's Foray into the Arm-Based CPU Market

NVIDIA, traditionally known for its high-end GPUs, is venturing into the Arm-based CPU market. According to reports from Reuters, both NVIDIA and AMD are set to go all-in on Arm-based CPUs to compete with Apple and Intel. This aligns well with Morgan Stanley's observations that indicate NVIDIA might collaborate with MediaTek for its first consumer-centric Arm-based CPUs. While this information stems from reputable sources, we must acknowledge that the official confirmation may come as soon as this Friday during a MediaTek press conference.

MediaTek: A Strategic Partner

MediaTek, another significant player in the chipset arena, is speculated to be NVIDIA's partner in this endeavor. Known for its Kompanio Arm chips that power Chromebooks, MediaTek's existing experience in the PC notebook market could be invaluable. A custom Arm architecture, co-designed by both MediaTek and NVIDIA, could indeed shake up the high-end notebook segment.

TSMC’s Advanced CoWoS Technology: A Game Changer

TSMC's CoWoS technology promises to add a unique dimension to this partnership. The technology allows for a CPU and GPU to be co-packaged on the same interposer. This means we could potentially see an Arm-based CPU paired with a discrete GPU chiplet designed by NVIDIA. Such a chipset design could be highly advantageous in terms of power efficiency and performance.

Timelines and Future Outlook

According to Chinese tech outlet UDN, the first test chips using TSMC's CoWoS technology are expected in Q2 of 2024. The chips would mark their entry into the high-end notebook market, aiming to compete directly with Apple and Intel. Although a long journey lies ahead with the consumer-ready chips expected to launch in 2025, these developments add an interesting twist to the PC market dynamics.

Final Thoughts

The collaboration between NVIDIA and MediaTek could usher in a new era of high-end notebook CPUs. Utilizing TSMC's advanced CoWoS technology, these Arm-based CPUs have the potential to disrupt the existing market dynamics. Although the road to consumer-ready products is long, these initial steps are highly promising. Stay tuned for further updates on this groundbreaking partnership.

Also Read:
https://news.thebadgamer.in/news/nvidia-and-mediatek-collaborate-on-arm-based-cpus-with-tsmcs-cowos-technology/

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